Western Digital Corp. (NASDAQ: WDC), a global data storage technology and solutions leader, today announced that it has received the Flash Memory Summit ‘Best of Show’ award for the company’s BiCS4 technology, the world’s first 3D NAND technology with 96 layers of vertical storage capability. The honor, received in the “Technology” category, recognizes innovations that will “change the way flash memory works and is used in products”. The recipients of this award are distinguished by significant differentiation of their intellectual property and patents from competing technologies in the flash memory industry.
“Our successful development of the world’s first 96-layer 3D NAND technology underscores Western Digital’s ongoing leadership in NAND flash and is a major milestone for continued NAND flash scaling,” said Jian Chen, senior vice president of memory technology at Western Digital. “BiCS4 provides superior capacity, density, performance and reliability for customers across a broad range of applications and allows us to keep pace with the escalating storage requirements of today’s data-centric world.”
Western Digital’s BiCS4 technology is the latest in a series of NAND flash “industry firsts” going back nearly three decades. These include development of the world’s first 64-layer 3D NAND technology in July 2016 and the world’s first 48-layer 3D NAND technology in 2015 and introductions of the industry’s first two-bits-per-cell (X2) and three-bits-per-cell (X3) technologies, among others. Last month, the company also announced the development of its first four-bits-per-cell (X4) 3D NAND technology.
“3D NAND is taking the market by storm, addressing a full range of end markets including consumer, mobile, computing and data center,” said Jay Kramer, chairman of the Flash Memory Summit Awards Program and president of Network Storage Advisors, Inc. “We are proud to recognize Western Digital’s 96 Layer 3D NAND BiCS4 for its innovation as the industry’s first 3D NAND technology with 96 layers of vertical storage capability. The 96 layers will enable new levels of storage capacity, density, performance and reliability to meet the future application needs of the marketplace.”
The presentation of the Flash Memory Summit award highlights the culmination of a strong presence at the Flash Memory Summit 2017 this week, including a keynote presentation by Western Digital Executive Vice President and Chief Technology Officer Martin Fink entitled, “Toward a Memory-centric Architecture.” Fink addressed how today’s Big Data and Fast Data applications are driving the need for purpose-built, data-centric compute architectures based on open standards and industry-wide innovation. Other company highlights at the show included demonstration of the company’s first SSD based on X4 technology, recognition by IT Brand Pulse in their “PCIe NVMe Card – SSD” awards category and numerous Western Digital speakers and managed sessions on a wide range of topics including NVMe, maximizing SSD performance for critical applications and persistent memory.
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