This is how Intel’s upcoming Core i7-5960X “Haswell-E” processor looks like after its integrated heat spreader (IHS) is delidded. Beneath the adhesive layer that secure the IHS to the package, Intel soldered the chip’s die to the IHS with a strong epoxy. This is a good news for overclockers, simply because soldering the CPU die to the IHS allows for much better heat conductivity than if the gap was to be filled with thermal interface material (TIM) like we’ve seen on the Core i7-3770K, 4770K, and 4790K.
Haswell-E is expected to be released in September 2014, and the rumoured specifications suggested that the top model namely the Core i7-5960X will have 8 cores, 16 threads and clocked at 3.0GHz with a 3.3GHz Turbo peak.
Latest posts by owikh84 (see all)
- EK Introduces ASUS X99 Series MOSFET Water Blocks - October 22, 2014
- ASUS Republic of Gamers Announces G751 Gaming Laptop - October 12, 2014
- ASRock Unleashes X99 Extreme11 Featuring 18 SATA3 Ports! - October 12, 2014