The revolutionary, unified design of the MasterAir G100M’s new custom Heat Column technology increases the direct contact surface area of the cooler for exceptional heat transfer and cooling performance. The entire block of the Heat Column, 46.3mm, is able to transfer a massive amount of heat away from the CPU in the shortest distance possible, increasing overall performance for the PC. This break-through design enables the low-profile MasterAir G100M to reach a TDP of 130W that matches the performance of traditional heatsinks. The G100M is designed for small form factor cases and compact PC builds. Equipped with an RGB ring and fan, which are both certified compatible with RGB capable motherboards, the MasterAir G100M will provide users with an illuminated, low-profile thermal solution.
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